Coefficient of thermal expansion is related to density of an object, so chips with higher density and circuit boards with lower density expands to different sizes at the same temperature. Something will have to give way eventually, and usually the solder balls that join chips to the board do so by building up cracks.
It WILL do other harms to the SSD. Semiconductor parts have limited reflow counts allowed to meet specifications such as failure rates, longevity, maybe power consumption too. It will be a factor at scale or over time. But it's free extra half life for semi broken parts too.
It WILL do other harms to the SSD. Semiconductor parts have limited reflow counts allowed to meet specifications such as failure rates, longevity, maybe power consumption too. It will be a factor at scale or over time. But it's free extra half life for semi broken parts too.